| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coating and developing method, and a coating and developing device for suppressing defective development caused by deposition of residue to a resist surface when a resist is applied and the development is performed after exposure to form a resist pattern. <P>SOLUTION: The coating and developing method comprises: a step of applying a resist liquid to the surface of a wafer W to form a resist film; a step of exposing the surface of the wafer W on which the resist film is formed; and a step of supplying acidic alcohol L onto the surface of the exposed wafer W to dissolve a part of low molecular layer of the resist film formed on the surface of the wafer and, further, to enhance solubility of the low molecular layer for developing liquid used for development which is performed on and after. <P>COPYRIGHT: (C)2010,JPO&INPIT |
