| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology to rapidly change the heat treatment temperature of a hot plate for heat-treating a substrate when a type of a to-be-treated substrate is changed into a different type. SOLUTION: A heating system is equipped with a heating unit 10a, including a hot plate 2 for heat-treating a wafer W; a main arm A2 for transferring the wafer W to the heating unit 10a; a storing section 50 for a cooling jig 6 which cools the hot plate 2; and a control section 110, which controls the main arm A2 to transfer the cooling jig 6 inside the storing section 50 to the heating unit 10a, when the temperature of the hot plate 2 of the heating unit 10a is changed from a first treatment temperature to a second temperature which is lower than the first temperature. COPYRIGHT: (C)2010,JPO&INPIT
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