| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a film onto a desired micro pattern by electrodeposition in a state free from waste. Ž<P>SOLUTION: First, an electrodeposition liquid 152 is accommodated in a container 151, and faces forming a metal pattern 104 of a substrate 101 are opposingly disposed in an opposing electrode 153 made of platinum in the electrodeposition liquid 152. In this state, a positive voltage is applied to the opposing electrode 153; and a negative voltage is applied to a seed layer 102 by a constant voltage supply 154. Here, a necessary wiring is connected to a metal pattern 105, so that the negative voltage is applied to the seed layer 102. By this cationic electrodeposition, an electrodeposition component in the electrodeposition liquid 152 is attached (deposited) onto a face (upper face) onto which the metal pattern 104 and the metal pattern 105 are exposed to form an electrodeposition insulating film 106. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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