发明名称 CONDUCTIVE PASTE, AND PRINTED CIRCUIT BOARD AND PLANAR HEAT GENERATING BODY EACH USING THE SAME
摘要 Disclosed is a conductive paste which is excellent in electrical conductivity, adhesion and bending resistance. This conductive paste exhibits excellent PTC characteristics even though it has low resistivity. Specifically disclosed is a conductive paste containing 40-200 parts by mass of a spherical carbon particle per 100 parts by mass of a resin containing a polyester resin and/or a polyurethane resin. This conductive paste is characterized in that the polyester resin and/or the polyurethane resin has a number average molecular weight of not less than 3000 and a glass transition temperature of from-40°C to 30°C. Also specifically disclosed are a printed circuit board and a planar heat generating body, each using such a conductive paste.
申请公布号 KR20100015580(A) 申请公布日期 2010.02.12
申请号 KR20097021467 申请日期 2008.04.14
申请人 TOYO BOSEKI KABUSHIKI KAISHA 发明人 ABE KAZUHIRO;TAGA KEIKO;TACHIKA HIROSHI
分类号 H01B1/24;H05B3/14;H05B3/20 主分类号 H01B1/24
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