THERMALLY ENHANCED SINGLE IN-LINE PACKAGE (SIP)

摘要

In a method and system for fabricating a thermally enhanced semiconductor device (200) is packaged as a through-hole single in-line package (SIP). A leadframe (210) having a die pad (220) to attach an IC die (230), a first plurality of conductive leads (240) formed from a first portion of metal sheet, and a second portion of metal sheet disposed on an opposite side of the IC die as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads are arranged in a single line and are capable of being through-hole mounted in accordance with the SIP. The second portion of metal sheet includes the die pad to form a heat spreader (260) in the form of the metal sheet. The heat spreader provides heat dissipating for the heat generated by the IC die.