| 摘要 |
Affords semiconductor wafers that achieve uniformization of semiconductor films. In a semiconductor wafer (1), between one and twenty pinholes (3) are formed per wafer for two-inch diameter semiconductor wafers (1). An effect whereby the warp in the semiconductor wafer (1) following semiconductor film formation is reduced, and dimensional variation following photolithographic exposure is reduced can thereby be obtained. This is presumed to be because dislocations in the semiconductor wafer (1) front side are extinguished by the presence of the pinholes (3). Accordingly, this can serve to make the quality of the semiconductor films consistent, make the performance of semiconductor devices consistent, and prevent fracture of the semiconductor wafer (1).
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