发明名称 |
Modular bonding pad structure and method |
摘要 |
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die. |
申请公布号 |
US7648903(B2) |
申请公布日期 |
2010.01.19 |
申请号 |
US20070840387 |
申请日期 |
2007.08.17 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
EMMERT JAMES R.;EVANS CHARLES;RENCHER MICHAEL ALVIN;DUAN HAORAN |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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