发明名称 HEAT TRANSPORT DEVICE AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat transport device permitting easy processing and stable mass production and electronic equipment mounted with the heat transport device. <P>SOLUTION: The heat transport device includes: a sealed container; working fluid sealed within the sealed container; and a plurality of plate-shaped members 21-25 each of which has both first holes having a first opening area and second holes having a second opening area smaller than the first opening area. The plurality of plate-shaped members 21-25 are laminated within the sealed container so that the inside of the first holes of the first plate-shaped member out of the plurality of plate-shaped members 21-25 is communicated with the inside of the first holes of the second plate-shaped member adjacent to the first plate-shaped member to hold the working fluid by applying capillary force to the working fluid in the liquid phase, and so that the opening faces of the second holes of the second plate-shaped member are arranged within the opening faces of the first holes of the first plate-shaped member to make the working fluid in the evaporated phase flow to the laminated direction. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010007905(A) 申请公布日期 2010.01.14
申请号 JP20080165352 申请日期 2008.06.25
申请人 SONY CORP 发明人 YOSHITAKA HIROYUKI;YAJIMA TAKASHI;HASHIMOTO MITSUO;OTA TOSHIRO;SHIGEMOTO TATSUHIKO;GOTO KAZUO
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利