| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus of a semiconductor wafer capable of resolving a trouble occurring when both of the front and rear are specular surfaces, while securing required planarity. <P>SOLUTION: The method of a semiconductor wafer includes: surface grinding processing (process S15) for grinding only the surface of a wafer of which etching is completed prior to polishing the wafer; and primary polishing processing (process S17) for simultaneously polishing the front and the rear of the wafer by non-abrasive particles which are abrasive, to set the front and rear of the wafer to be a specular surface and a fogging state, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT |
