| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a break determination device for easily performing the determination of a break of a solder junction in a short time. Ž<P>SOLUTION: The break determination device for determining whether each solder junction, through which a printed wiring board for mounting components and each pin terminal of the components are joined together by soldering, breaks due to thermal fatigue includes: a component information read-in part 111 for inputting a pin coordinate information related to the coordinate where the pin terminal is soldered on the printed wiring board; a material information read-in part 112 for inputting the coefficient of thermal expansion of the pin terminal and the printed wiring board; and a break determination part 114 for calculating the inter pin distance between the pin terminals for each component using the pin coordinate information and determining using the calculated pin distance and the thermal expansion coefficient for each of the solder junctions whether the solder junction is going to break by thermal fatigue or not. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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