WEISS-LED-SCHEINWERFER

摘要

A vehicle headlight (12) that employs a plurality of LED units (38) that emit white light. Each LED unit (38) employs chip-on-board technology where LED semiconductor chips (64) are mounted directly to a submount substrate (56) using solder or stud bumps (60). An elongated lens (28) is molded over the LED unit (38) in contact with a base substrate (48). Light emitted from the semiconductor chip (64) is reflected and directed by the lens (28) to generate a beam of light (58). Some of the light emitted from the LED semiconductor chip (64) is redirected back to the submount substrate (56) to be reflected back into the lens (28) to increase the light intensity of the LED unit (38). Several of the elongated lens (28) and associated LED units (38) are optically glued to a single prism (24) that collects all of the light beams from all of the LED units (38).