COMPOSITE MATERIAL, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a composite material which is suitable for a heat spreader of a semiconductor device, and excellent in the surface nature, and to provide a manufacturing method thereof.

SOLUTION: A composite raw material (cold isostatic press (CIP) formed body) 11 in which particles consisting of silicon carbide are distributed in a metal matrix consisting of aluminum base alloy is prepared, and inserted into a cylindrical material 12 consisting of the aluminum base alloy. The cylindrical material 12 (buret 10) which stores the composite material is extruded to form a coating raw material 20 with a coating layer 21. This extrusion serves also as sintering. The coating raw material 20 is rolled out to manufacture the composite material with a surface layer consisting of the aluminum base alloy on the surface of a base consisting of Al-SiC composite material. The composite material is excellent in the surface nature by providing the surface layer constituted by performing plastic working. Surface roughness Ra of the surface layer is≤1.5μm.

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