发明名称 Positive photoresist composition and method of forming resist pattern
摘要 A positive resist composition that includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer (A1) containing a first structural unit (a1) derived from hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester having an alcoholic hydroxyl group, in which a portion of the hydroxyl groups of the structural units (a1) and the alcoholic hydroxyl groups of the structural units (a2) have been protected with the acid dissociable, dissolution inhibiting groups; and either the acid generator component (B) includes a diazomethane-based acid generator and an onium salt-based acid generator; or the composition further contains a compound, which contains at least one acid dissociable, dissolution inhibiting group, and generates an organic carboxylic acid under the action of acid generated from the component (B).
申请公布号 US7629105(B2) 申请公布日期 2009.12.08
申请号 US20040566425 申请日期 2004.09.17
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 YAMAZAKI AKIYOSHI;TANI KAZUO;MOTOIKE NAOTO;MAEMORI SATOSHI;YOSHIZAWA SACHIKO
分类号 G03F7/004;G03F7/039;G03F7/30;H01L21/027 主分类号 G03F7/004
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