| 摘要 |
PURPOSE: A chemical vapor deposition apparatus is provided to arrange a guide ring at the edge of wafer uniform by moving a stationary chuck in the X direction and Y direction and controlling the center of the wafer. CONSTITUTION: In a chemical vapor deposition apparatus, a stationary chuck(11) holds a wafer(10) and arranges the wafer according to a fixed position of a wafer. A measurement unit(13) measures the position of the wafer on the stationary chuck and controls the stationary chuck. A guide ring(14) prevents a deposition film from being deposited on the around the wafer in a deposition process. The measure unit measures a distance from the wafer in contactless, and the measure unit uses a range meter using an infrared ray. The stationary chuck controls the position of the wafer so that the edge of wafer is arranged at the guide ring uniformly.
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