发明名称 METHOD OF FORMING PHOTOSENSITIVE RESIN FILM, METHOD OF FORMING SILICA-BASED COATING FILM, AND DEVICE AND MEMBER INCLUDING SILICA-BASED COATING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a photosensitive resin film with which a silica-based coating film usable as an interlayer dielectric is relatively easily formed and which is excellent in process margin and makes a formed silica-based film excellent in resolution and heat resistance, and to provide a method of forming a silica-based coating film using the same. <P>SOLUTION: The method of forming the photosensitive resin film includes a step of coating the top of a substrate with a photosensitive resin composition comprising a siloxane resin obtained by hydrolytic condensation of a specific silane compound, a solvent in which the siloxane resin dissolves and a naphthoquinonediazidesulfonic acid ester and carrying out vacuum drying to form a photosensitive resin film. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009276742(A) 申请公布日期 2009.11.26
申请号 JP20080321117 申请日期 2008.12.17
申请人 HITACHI CHEM CO LTD 发明人 KASUYA KEI;ABE KOICHI;AOKI YOSUKE
分类号 G03F7/075;B32B9/00;C09D5/00;C09D7/12;C09D183/04;G03F7/004;G03F7/023;G03F7/38 主分类号 G03F7/075
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