| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an antenna-integrated high frequency IC package capable of preventing the degradation of circuit characteristics by improving a degree of design freedom of an antenna with simple structure. <P>SOLUTION: A dielectric cover 107 having a recess 112 for covering a peripheral side surface and upper part of a high frequency IC chip with a space formed therebetween is fixed on a surface of a dielectric substrate 101 having a planar grounding conductor 102 formed on a surface and the high frequency IC chip 104 mounted. An antenna conductor pattern 109 is formed on an outer side surface or a bottom of the recess in the dielectric cover. The antenna conductor pattern and the high frequency IC chip are connected by high frequency transmission paths 105, 106, 103, 110, 108. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
