SCRIBE LINE FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a scribe line forming method by which a vertical crack having a sufficient depth can be generated in a glass substrate without causing troubles such as occurrence of chipping at an end part of the glass substrate or occurrence of a crack in an undesired direction.

SOLUTION: The scribe line forming method comprises forming a scribe line starting from a vertical crack and includes: a process for forming a vertical crack serving as a start point of a scribe line on a surface of a brittle material substrate; a process for heating the brittle material substrate to a temperature lower than the softening point of the brittle material substrate by forming a laser beam irradiation region to the vertical crack and relatively moving the laser beam irradiation region along a predetermined scribe line set on the brittle material substrate; and a process for forming a cooling region at backside of the relative movement direction of the laser beam irradiation region. In the method, the vertical crack is formed at a position within a brittle material substrate and in the vicinity of an end part of the substrate.

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