METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE OR CIRCUIT ASSEMBLY USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER CONTACT POINTS IN A DIP PROCESS,申请号WO2009US37491-传众专利搜索

发明名称	METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE OR CIRCUIT ASSEMBLY USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER CONTACT POINTS IN A DIP PROCESS
摘要	The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
申请公布号	WO2009117476(A3)	申请公布日期	2009.11.19
申请号	WO2009US37491	申请日期	2009.03.18
申请人	HENKEL CORPORATION;CHAN, CHEW, B.;JI, QING;CURRIE, MARK;POOLE, NEIL;KELLY, GERALDINE	发明人	CHAN, CHEW, B.;JI, QING;CURRIE, MARK;POOLE, NEIL;KELLY, GERALDINE
分类号	H01L23/48;H01L21/60;H01L23/02	主分类号	H01L23/48
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