发明名称 STRUCTURE FOR PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND PRINTED WIRING BOARD WITH THE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a structure for a printed wiring board in which a resistor having a desired resistance value is manufactured with good reproducibility by suppressing change in sectional shape of the resistor. Ž<P>SOLUTION: The method includes a stage of using a laminated sheet 3 having a first base 1 and a second base 2 stuck on one surface of the first base 1 and forming a peelable member 5 so that the second base 2 is disposed between the peelable memer 5 and the first base 1, a stage of forming a micropore 6 continuously extending in the direction wherein the member 5 and second base 2 overlap each other, a stage of charging conductive paste 4 into the micropore 6, and a stage of removing the member 5 from the second base 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009272498(A) 申请公布日期 2009.11.19
申请号 JP20080122678 申请日期 2008.05.08
申请人 FUJIKURA LTD 发明人 OGAWA TAIJI;FUJINAMI HIDEYUKI;KUAMI HIROSHI
分类号 H05K3/10;H05K1/16 主分类号 H05K3/10
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