发明名称 |
Wafer applied thermal-mechanical interface |
摘要 |
An improved semiconductor assembly that provides a highly efficient heat-dissipating property, while also providing enhanced mechanical properties, includes a semiconductor device mounted on a substrate, a layer of low modulus material laminated to the semiconductor device, and a heat-conductive member urged against the low modulus layer to provide improved mechanical isolation between the semiconductor and the heat-dissipating member. |
申请公布号 |
EP1930944(A3) |
申请公布日期 |
2009.01.07 |
申请号 |
EP20070120982 |
申请日期 |
2007.11.19 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
OMAN, TODD P.;CLAUCHERTY, GORDON A. |
分类号 |
H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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