发明名称 Electrostatic chuck
摘要 An electrostatic chuck device includes an electrostatic chuck section including a substrate and a power supply terminal for applying a DC voltage to an electrostatic-adsorption inner electrode; and a metal base section fixed to the other main surface of the electrostatic chuck section. Here, a concave portion is formed in the main surface of the metal base section facing the electrostatic chuck section and a dielectric plate is fixed to the concave portion. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric constant of the insulating adhesive bonding layer is smaller than that of any one of the dielectric plate and the substrate.
申请公布号 US7619870(B2) 申请公布日期 2009.11.17
申请号 US20070834994 申请日期 2007.08.07
申请人 TOKYO ELECTRON LIMITED;SUMITOMO OSAKA CEMENT CO., LTD. 发明人 HIMORI SHINJI;MATSUYAMA SHOICHIRO;MATSUURA ATSUSHI;INAZUMACHI HIROSHI;KOSAKAI MAMORU;MIURA YUKIO;MAKI KEIGO
分类号 H01T23/00 主分类号 H01T23/00
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