| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high storage stability in a liquid state and giving a cured product excellent in compression strength and deformation recovering property after compressive deformation after the composition is cured. <P>SOLUTION: The photosensitive resin composition contains (A) a resin having a branched and/or alicyclic structure, an acidic group and an ethylenically unsaturated bond in side chains, (B) a polymerizable compound, (C) a photopolymerization initiator and (D) a hydrophilic organic solvent having a boiling point of 150°C or higher. <P>COPYRIGHT: (C)2010,JPO&INPIT |
