| 摘要 |
<P>PROBLEM TO BE SOLVED: To check at which stage of a production process a substrate warp as a factor of causing a secular failure occurs. <P>SOLUTION: An electronic component mounting apparatus 1 equipped with a solder printing apparatus 3, an electronic component mounting apparatus 5, and a reflow apparatus 7 includes a means of obtaining three-dimensional data of the surface of a substrate, a means of creating an approximate curved surface representing the appearance of the substrate according to the obtained three-dimensional data, and a means of storing the relationship of ID information of the substrate and the approximate curved surface. Since the substrate warp state in component mounting processes can be obtained from the substrate ID information and its approximate curved surface data when a substrate defect occurs as the years pass, it is possible to analyze the causal relationship of the defect and the substrate warp and take appropriate measures to meet the situation such as review of production conditions. <P>COPYRIGHT: (C)2010,JPO&INPIT |
