发明名称 |
SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE EQUIPPED WITH THE SEMICONDUCTOR ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element in which the electrical, physical properties and stability are improved. SOLUTION: The semiconductor element 10 comprises a substrate 1 and a semiconductor layer 5 disposed so as to overlap on the substrate 1, wherein the semiconductor layer 5 comprises a binder resin 2 and first fine particles 3 dispersed in the binder resin 2 and made of at least one or more kinds of oxide semiconductors. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009253142(A) |
申请公布日期 |
2009.10.29 |
申请号 |
JP20080101305 |
申请日期 |
2008.04.09 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;BROTHER IND LTD |
发明人 |
KAMATA SHUNEI;YOSHIDA MANABU;ASANO TAKESHI;SHINKAI YUJI;TSUMURA SHIN |
分类号 |
H01L49/00;H01L21/336;H01L29/47;H01L29/786;H01L29/861;H01L29/872;H01L51/05;H01L51/30;H01L51/40 |
主分类号 |
H01L49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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