| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting tool capable of uniformizing a heating temperature distribution by a suction nozzle for heating an electronic component sucked and held by heating by a heater. <P>SOLUTION: Suction grooves 32 communicated to intake vents 31 and recesses 32a are arranged in a line in a desired region at desired density in the suction surface 34 of the suction nozzle 3 for sucking and holding an electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
