| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component which has improved adhesion with substrates and also enhanced strength and reliability when buried between two resin substrates, and to provide an electronic component module. <P>SOLUTION: In a dielectric element 1a, a side face 2E is roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate 10 and insulating material 30 is increased, adhesion with resin substrates is improved, and strength and reliability can be enhanced when buried between two resin substrates. In the dielectric element 1a, the surface roughness Ra of the side face 2E is 5,000 nm or less, so that when burying the dielectric elements 1a and 1b between the glass epoxy resin substrate 10 and insulating material 30, the occurrence of air bubbles between surfaces of the dielectric elements 1a and 1b and the resin can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
