发明名称 Suspension Board with Circuit and Production Method Thereof
摘要 A suspension board with circuit includes an insulating layer formed with a first opening, a conductive layer formed on the insulating layer so as to fill the first opening, a metal thin film formed so as to cover a surface of the conductive layer exposed from the first opening, and be interposed between the conductive layer and the insulating layer, and a metal supporting layer formed with a second opening surrounding the first opening so as to underlie the insulating layer. The metal supporting layer includes a covering portion provided in the second opening so as to cover the first opening.
申请公布号 US2009255717(A1) 申请公布日期 2009.10.15
申请号 US20090385626 申请日期 2009.04.14
申请人 NITTO DENKO CORPORATION 发明人 MIZUSHIMA AYA;NAITO TOSHIKI
分类号 H05K1/03;C25D5/02 主分类号 H05K1/03
代理机构 代理人
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