| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed circuit board in which a connection with a built-in electronic component is suitably made. <P>SOLUTION: A positioning mark 31 is formed on a core substrate 30, and a via hole 60 for a connection with a pad 24 of an IC chip 20 is formed on an inter-layer resin insulating layer 50 on the basis of the positioning mark 31 as a reference. Consequently, the via hole 60 is accurately formed on the pad 24 of the IC chip 20, and the pad 24 and the via hole 60 are securely connected to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
