发明名称 PLASMA PROCESSING DEVICE, GAS SUPPLY MEMBER, AND ITS PRODUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To produce a high quality gas supply member by bonding a plurality of metal blocks tightly while preventing solder material from overflowing into a channel formed between the metal blocks. SOLUTION: On the bonding surface of a plurality of metal blocks 60-62, solder paste 75 is applied to a region separated inward from the outer edge of the bonding surface, the plurality of metal blocks 60-62 are then brought into pressure contact with each other and heated to solder the plurality of metal blocks 60-62 and produce a gas supply member 40. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009231558(A) 申请公布日期 2009.10.08
申请号 JP20080075553 申请日期 2008.03.24
申请人 TOKYO ELECTRON LTD 发明人 NISHIMOTO SHINYA
分类号 H01L21/31;B23K1/00;B23K1/14;B23K103/10;C23C16/455;H01L21/3065 主分类号 H01L21/31
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