| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate in which a translucent covering member of appropriate shape is formed at an appropriate position, for taking out uniform light. <P>SOLUTION: The semiconductor device includes: a package where a recess is formed on its upper surface; a conductive wiring which is provided in the package, with part thereof exposed in the recess; a semiconductor element which is arranged in the recess and is connected to the conductive wiring; and a translucent covering member embedded in the recess. Protruding part is formed on the outer periphery of the recess, on the upper surface of the package. <P>COPYRIGHT: (C)2010,JPO&INPIT |
