发明名称 BRAZING FILLER METAL, ELECTRONIC DEVICE, AND METHOD FOR SEALING ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To secure the melting point and the brazability of a brazing filler metal of Au-Ag-Cu alloy, while decreasing the weight ratio of Au constituting the brazing filler metal. Ž<P>SOLUTION: The brazing filler metal has a composition ratio äAu(wt.%), Ag(wt.%), Cu(wt.%)} existing within the region enclosed by straight lines connecting 8 points, which are a point 1 (42, 33, 25), a point 2 (38, 34, 28), a point 3 (21, 47, 32), a point 4 (10, 59, 31), a point 5 (9, 63, 28), a point 6 (20, 57, 23), a point 7 (31, 47, 22), and a point 8 (42, 35, 23), in a ternary composition diagram of Au, Ag, and Cu, and has the balance consisting of inevitable elements. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009220147(A) 申请公布日期 2009.10.01
申请号 JP20080067177 申请日期 2008.03.17
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI SHOJI
分类号 B23K35/30;H01L23/10;H03H3/02 主分类号 B23K35/30
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