Polishing platen and polishing apparatus

摘要

The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen (12) according to the present invention includes a surface to which a polishing pad is attached. The surface of the polishing platen (12) includes a combination of a first surface (20) and a second surface (21) having a surface roughness which is different from that of the first surface (20).