| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a conductive film which is excellent in adhesion with a base, and when light is used for energy, can improve the adhesion in high sensitivity and is excellent in adaptability to a low-temperature process and to provide a method for manufacturing a printed wiring board, which includes the conductive film forming method in steps thereof. SOLUTION: The method for forming a conductive film includes: a step (a) for forming a resin layer (resin layer A) containing a radical polymerizable compound and thermosetting resin, whose gelling time at 70°C is≤60 min, on an organic resin base; a step (b) for forming a resin-composition resin layer (resin layer B) containing resin having a functional group correlating with a non-electrolytic plating catalyst or its precursor, a radical generation agent and a radical polymerizable compound and capable of adsorbing the non-electrolytic plating catalyst or its precursor; a step (c) for applying the non-electrolytic plating catalyst or its precursor to the layer (resin layer B) capable of adsorbing the non-electrolytic plating catalyst or its precursor; and a step (d) for performing non-electrolytic plating to form a non-electrolytic plating film. COPYRIGHT: (C)2009,JPO&INPIT
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