发明名称 ATMOSPHERIC PRESSURE PLASMA PROCESSING METHOD AND DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an atmospheric pressure plasma processing method and device capable of securing plasma treatment of high reliability as it can check a lighting state of plasma and an irradiation state of plasma after plasma lighting, in treating a treated object with atmospheric plasma. <P>SOLUTION: In the atmospheric pressure plasma treatment method of supplying first gas 15 to a given reaction space 11 in the vicinity of an atmospheric pressure, and at the same time, impressing a high-frequency voltage on an antenna 13 or an electrode in the vicinity of the reaction space 11 to generate primary plasma 16, irradiating the primary plasma 16 or a secondary plasma 21 generated by colliding the primary plasma 16 with second gas 18 toward a treated surface 6 to carry out plasma treatment of the treated surface 6, a dimension of a reflective wave after lighting of primary plasma 16 is detected, and it is to be checked whether the primary plasma 16 is lit by comparing the dimension of the reflective wave with a first given value. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009206022(A) 申请公布日期 2009.09.10
申请号 JP20080049363 申请日期 2008.02.29
申请人 PANASONIC CORP 发明人 MATSUMORI MASASHI;TSUJI HIROYUKI;NAKATSUKA SHIGEKI;INOUE KAZUHIRO
分类号 H05H1/24;C23C16/505;H01L21/3065;H05H1/00 主分类号 H05H1/24
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