| 摘要 |
PROBLEM TO BE SOLVED: To suppress a warp of a base substrate in heat treatment, and to suppress defective quality caused by local changes in the temperature of the substrate. SOLUTION: The apparatus includes a treatment chamber, a supporting base provided in the treatment chamber, a plurality of supports provided over the supporting base and are arranged to support the base substrate, and a heating unit for heating the base substrate. Each position of the plurality of supports can be changed, by preparing a plurality of fixing parts for loading and unloading the supports to the supporting base, and selectively mounting the plurality of supports to the plurality of fixing parts. COPYRIGHT: (C)2009,JPO&INPIT |
