| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor apparatus which enable secure cleaning of a nozzle that do not allow a resist adhering and fixing to the front end or the vicinity of a resist delivery nozzle or the vicinity of the front end of the nozzle interior to peel off upon resist delivery to prevent quality fault when the semiconductor apparatus is manufactured. SOLUTION: A cleaning means (cleaning nozzle 101) is provided for a resist applying means (resist delivery nozzle 104) that applies resist to the semiconductor apparatus when the semiconductor apparatus is manufactured. Cleaning by the cleaning means is carried out by performing cleaning with a solvent (solvent from a first tube 102), and then performing drying with a gas (gas from a second tube 103) from a direction opposite to a resist delivery direction (direction of resist delivery by the resist delivery nozzle 104). COPYRIGHT: (C)2009,JPO&INPIT
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