| 摘要 |
The invention relates to a microchannel heat sink for cooling semiconductor elements. The aim of the invention is to prevent, while using the advantages related to a surface improvement brought about by a contact metallization, leakages caused by corrosion while avoiding the reduction of the thermal efficiency of the microchannel heat sink. The invention is characterized in that at least one electrically insulating inorganic protective layer or at least one final protective layer of at least one refractory metal is applied to sealing surfaces for sealing elements that enclose the coolant inlet and coolant outlet openings and to the inner surfaces of a coolant inlet and a coolant outlet. |
