| 摘要 |
A dicingÀdie bonding film is provided to ensure excellent preserving stability of products, to reduce the generation of pick-up defectives when applied to a manufacturing method of a semiconductor device. A dicingÀdie bonding film(10) comprises a dicing film having a radiation-curable adhesive layer(2) on a substrate(1); and a die bond film(3) formed on the adhesive layer. The adhesive of the adhesive layer comprises an acrylic polymer. The acid value of the acrylic polymer is 0.01-1 and the iodine value of the acrylic polymer is 5-10. |
