发明名称 |
HEAT DISSIPATION DEVICE AND POWER MODULE |
摘要 |
A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
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申请公布号 |
US2009200065(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20060994896 |
申请日期 |
2006.07.05 |
申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;SHOWA DENKO K.K. |
发明人 |
OTOSHI KOTA;KONO EIJI;TOH KEIJI;TANAKA KATSUFUMI;FURUKAWA YUICHI;YAMAUCHI SHINOBU;HOSHINO RYOICHI;WAKABAYASHI NOBUHIRO;NAKAGAWA SHINTARO |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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