Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

摘要

A plurality of devices are hermetically packaged at the wafer level by 1) providing a substrate wafer having a plurality of at least partially-formed devices thereon; 2) forming separation walls on the substrate wafer, around different ones of the at least partially-formed devices; and 3) wafer bonding a cap wafer to the separation walls, to form a plurality of hermetic packages.