| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses a reduction of the sampling number on a wafer of an LSI chip by reducing an occupied area of a scribing TEG (test element group) and provides a cost reduction. <P>SOLUTION: The semiconductor device is equipped with: a first electrode terminal group 101; and one or more second electrode terminal groups 102. In the first electrode terminal group 101, plural first electrode terminals 1, 1, ... are formed to be lined according to a pitch of a measuring needle. In the second terminal groups 102, plural second electrode terminals 2, 2, ... are formed to be lined according to a pitch of a measuring needle, respectively. And, between adjacent first electrode terminals 1, 1, ... every one second electrode terminal 2 constituting each of the second electrode terminal groups 102 is arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT |
