| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for reducing the warp, especially the warp accompanied by twist, of a semiconductor package without increasing the number of parts. <P>SOLUTION: The semiconductor device is provided with a wiring board 102, a plurality of semiconductor chips 103 laminated on the upper surface of the wiring board 102, a plurality of adhesion members 106, 107 and 108 for attaching the semiconductor chips with each other or the semiconductor chip and the wiring board, and a sealing resin 113 for covering them. The width of the first layer semiconductor chip of the top layer is smaller than the width of a second layer semiconductor chip to which the first layer semiconductor chip is attached. The upper surface of the second layer semiconductor chip has an angle with the upper surface of the wiring board 102, and the center of the first layer semiconductor chip is positioned by being shifted in the decreasing direction of thickness from the upper surface of the second layer semiconductor chip to the upper surface of the wiring board 102 relative to the center of the second layer semiconductor chip. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
