发明名称 |
LAMINATE FOR PRINTED WIRING BOARD |
摘要 |
<p>A laminate for a printed wiring board having a laminate structure comprising an electrical insulator layer (A) and an electrical conductor layer (B) bonded directly to each other, wherein the electrical insulator layer (A) is formed of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and a polymerizable unsaturated bond in amounts of (a) being from 50 to 99.89 mol%, (b) being from 0.1 to 49.99 mol% and (c) being from 0.01 to 5 mol%, based on ((a)+(b)+(c)), and the electrical conductor layer (B) has a surface roughness of at most 10 µm on the side being in contact with the electrical insulator layer (A). The laminate for a printed wiring board is excellent in signal response in a high frequency region.</p> |
申请公布号 |
EP1820637(A4) |
申请公布日期 |
2009.06.24 |
申请号 |
EP20050814526 |
申请日期 |
2005.12.07 |
申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
IWASA, TSUYOSHI;FUNAKI, ATSUSHI;HIGUCHI, YOSHIAKI |
分类号 |
H05K1/03;B32B15/082;C08F214/18 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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