| 摘要 |
PROBLEM TO BE SOLVED: To suppress the reduction of a bump tip area accompanied by the miniaturization of a circuit wiring pattern by forming a bump ranging over the whole width of the circuit wiring pattern while achieving the high densification of a circuit wiring pattern arrangement by narrowly designing a circuit wiring pattern gap by preventing the contact of bumps with each other caused by the protrusion of plating when forming a circuit wiring board with a bump. SOLUTION: There is prepared a one-sided laminate 10 having a seed layer 12 on one face of an insulating base material 11. There is provided a first plating resist layer 14 at the part excluding a circuit forming part 13 on the surface of the seed layer 12. A circuit wiring pattern 15 is formed on the surface of the exposed seed layer 12 by plating. There is provided a second plating resist layer 17 at the part excluding a bump formation scheduled part 16a ranging the whole width of the circuit wiring pattern 15 on the circuit wiring pattern 15. A bump 16 is formed on the exposed part by electrolytic plating. After removing the first/second plating resist layers 14, 17, the exposed seed layer 12 is removed by etching. COPYRIGHT: (C)2009,JPO&INPIT
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