| 摘要 |
PROBLEM TO BE SOLVED: To certainly prevent the generation of cracks of a package by obtaining a water content of a semiconductor package after baking highly accurately and setting a water content in airtight packaging equal to or below a permitted water content. SOLUTION: A method determines whether vapor proof packaging and shipment are allowed by finding a water content m(x, i) reached after time t(i) at this step (i) according to a predetermined formula based on a water content m(x, i-1) of a semiconductor package 10 and comparing a final water content m(x, n) reached after time t(n) at a final step (n) with the a permitted water content m0. COPYRIGHT: (C)2009,JPO&INPIT
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