发明名称 CERAMIC COMPACT FOR MOUNTING ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND ELASTIC COATING SHEET USED FOR THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic compact which can accurately form closed-end hollows in manufacturing the ceramic compact having the closed-end hollows, and advantageously prevent damage on an electronic circuit during mold release. SOLUTION: Perforated green sheets having holes are stacked on a substrate green sheet 21 where the electronic circuit has been printed, so that a laminated green sheet body 29 having closed-end hollows 28 is obtained. Next, the laminated green sheet body 29 is covered with an expansible elastic coating sheet 30. After the closed-end hollows 28 are covered with the elastic coating sheet 30, the laminated green body 29 covered with the elastic coating sheet 30 is stored in a synthetic resin sheet bag and is vacuum-packed. In this state, the laminated green body 29 is put into a high-pressure fluid to pressure-bond the substrate green sheet 21 and the perforated green sheets, so that a ceramic precursor is molded. After that, the ceramic precursor is calcined to obtain the ceramic compact. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009117565(A) 申请公布日期 2009.05.28
申请号 JP20070288050 申请日期 2007.11.06
申请人 MARUWA CO LTD 发明人 MAEDA SEIJI;NAGAE TATSUNORI
分类号 H05K3/46 主分类号 H05K3/46
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