发明名称 LED PACKAGE, AND ILLUMINATION DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE PROVIDED THEREWITH
摘要 In an LED package, LED chips are connected in parallel by wires between lead frames connected to terminals. When an open circuit failure such as the coming off of the wire occurs in one of the LED chips in the LED package that is being energized, a current twice as high as that flowing through the other LED chip prior to the open circuit failure is passed through the other LED chip, and thus the amount of light emitted therefrom is increased about two-fold. Consequently, the amount of light emitted from the LED package does not change significantly.
申请公布号 US2009135592(A1) 申请公布日期 2009.05.28
申请号 US20060282899 申请日期 2006.11.06
申请人 SHARP KABUSHIKI KAISHA 发明人 HAMADA TETSUYA
分类号 F21V8/00;F21V21/00;H01L33/62 主分类号 F21V8/00
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