| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a mounting structure which ensures excellent adhesion between an electrode or a semiconductor chip and a circuit board and underfill agent and also ensures excellent connection reliability while reducing generation of voids in the underfill agent, and to provide its production process. <P>SOLUTION: Electrodes 2 of a semiconductor chip 1 are bonded to electrode pads 4 of a circuit board 3. The gap between the semiconductor chip 1 and the circuit board 3 is sealed with a second resin layer 5. A first resin layer 7 is provided in close contact around the electrodes 2 of a semiconductor chip 1. The second resin layer 5 is provided around the first resin layer 7. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
