| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for inexpensively and stably manufacturing a multilayer printed wiring board incorporating a resistance element wherein the resistance value of the incorporated resistance element is stable, by making thickness reduction of metal wiring and laser through resistance compatible. <P>SOLUTION: In the manufacturing method of the printed wiring board with a film resistance element formed in an inner layer wiring layer in the multilayer printed wiring board for which a metal wiring layer 2 and an organic resin insulating layer 1 are laminated and the metal wiring layers are connected by a blind via, an electrode 2a and a receiving land 2b to be a pair are formed on the metal wiring layer on one surface of one of the organic resin insulating layers. On the electrode and the receiving land, a conductive surface treatment layer 4 for oxidization prevention is formed, the film resistance element 5 is printed and formed between the electrodes to be a pair, a laminate plate 9 of metal foil or metal coating is attached to the side of the metal wiring layer where the film resistance element is formed through an adhesive material under heating and pressurization, and a blind conduction hole 14 is formed by irradiating the receiving land with a laser beam and partially removing the laminate plate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
