发明名称 SEMICONDUCTOR DEVICE AND ITS INSPECTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which enables to inspect a temperature detecting circuit formed on a semiconductor integrated circuit without additionally installing temperature control devices such as a remote temperature sensor and the like, and also to provide its inspecting method. SOLUTION: A semiconductor unit 100 is provided with: a temperature detecting circuit 110 which comprises a first current source 111 outputting the first current which changes according to temperature change, a second current source 112 enabling to control the output current with a reference signal VREF and outputting the second current which is substantially constant with respect to temperature, and a current-voltage converting circuit 113 which inputs the difference between the first current and the second current as a third current and outputs as the temperature signal VTMP after converting to voltage; and a signal processing circuit 120, formed on the same chip of the temperature detecting circuit 110, whose heating value changes with a setting signal VSET. A determining means determines whether the semiconductor unit 100 is suitable for use by comparing the temperature signal VTMP outputted from the temperature detecting circuit 110, when the setting signal VSET and the reference signal VREF are applied, with the inspection reference value VTEST. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009109314(A) 申请公布日期 2009.05.21
申请号 JP20070281338 申请日期 2007.10.30
申请人 OLYMPUS CORP;OLYMPUS IMAGING CORP 发明人 OSAWA MASAHITO;TAKEI TATSUYA;TAMIYA KIMINARI;TSUCHIYA HITOSHI;KARIYA MITSUTOMO;KIKUCHI TETSUHISA;NAKADA KOICHI
分类号 G01K15/00;G01R31/26;H01L21/66;H01L21/822;H01L27/04 主分类号 G01K15/00
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